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DISCRETE SEMICONDUCTORS
DATA SHEET
ndbook, halfpage
M3D184
BZA109 9-fold ESD transient voltage suppressor
Product specification Supersedes data of 1997 Oct 27 File under Discrete Semiconductors, SC01 1997 Dec 01
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
FEATURES * ESD rating >8 kV, according to IEC1000-4-2 * SOT163-1 surface mount package * Common anode configuration * Non-clamping range 0.5 to 6.8 V * Maximum non-repetitive peak reverse power dissipation: 25 W at tp = 1 ms * Maximum clamping voltage at peak pulse current: 10 V at IZSM = 2.5 A. APPLICATIONS * For 9-bit wide undershoot/ overshoot clamping and fast ESD transient suppression in: - Computers and peripherals - Audio and video equipment - Business machines - Communication systems - Medical equipment.
IN8 9 12 OUT8 11 OUT9 IN9 10
handbook, 4 columns
BZA109
PINNING PIN 1 to 5 6 and 15 7 to 10 11 to 14 16 to 20 DESCRIPTION input (IN1 to IN5) common anode (GND) input (IN6 to IN9) output (OUT9 to OUT6) output (OUT5 to OUT1)
DESCRIPTION 9-fold monolithic transient voltage suppressor in an SO20; SOT163-1 surface mount package. The device is ideal in situations where board space is a premium.
IN1 IN2 IN3 IN4 IN5 GND IN6 IN7
1 2 3 4 5
20 OUT1 19 OUT2 18 OUT3 17 OUT4 16 OUT5 20 19 18 17 16 15 14 13 12 11
SO20
6 7 8 15 GND 14 OUT6 13 OUT7
MBK268
1
2
3
4
5
6
7
8
9
10
Fig.1 Pin configuration for SO20 (SOT163-1) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL Per diode IZ IF IFT IFSM IZSM Ptot PZSM Tstg Tj Notes 1. Current is flowing from input to corresponding output. 2. One or more diodes loaded. 1997 Dec 01 2 working current continuous forward current feed-through current non-repetitive peak forward current non-repetitive peak reverse current total power dissipation non-repetitive peak reverse power dissipation storage temperature operating junction temperature Tamb = 25 C Tamb = 25 C Tamb = 25 C; note 1 tp = 1 ms; square pulse tp = 1 ms; square pulse; see Fig.2 Tamb 25 C; note 2; see Fig.3 tp = 1 ms; square pulse; see Fig.4 - - - - - - - -65 -65 20 100 100 4.5 2.5 1.25 25 +150 +150 mA mA mA A A W W C C PARAMETER CONDITIONS MIN. MAX. UNIT
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS one or more diodes loaded
BZA109
VALUE 100
UNIT K/W
ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL Per diode VZ VF VZSM IH rdif SZ Cd working voltage forward voltage non-repetitive peak reverse voltage input high current differential resistance temperature coefficient of working voltage diode capacitance IZ = 250 A IF = 100 mA IZSM = 2.5 A; tp = 1 ms VIN = 5.25 V IZ = 250 A IZ = 5 mA see Fig.5 VR = 0; f = 1 MHz VR = 5.25 V; f = 1 MHz - - - - 200 100 pF pF 6.4 - - - - - 6.8 - - - - 3 7.2 1.1 10 0.5 100 - V V V A mV/K PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1997 Dec 01
3
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
GRAPHICAL DATA
BZA109
handbook, halfpage
10
MBK269
handbook, halfpage
2.0
MBK393
IZSM (A)
Ptot (W) 1.5
1.0
0.5
1 10-1
1
tp (ms)
10
0 0 50 100 150 200 Tamb (C)
One or more diodes loaded.
Fig.2
Maximum non-repetitive peak reverse current as a function of pulse time.
Fig.3 Power derating curve.
102 handbook, halfpage PZSM (W)
MBK270
handbook, halfpage
150
MBK272
Cd (pF) 100
50
10 10-1
0 1 tp (ms) 10 0 2 4 VR (V) 6
PZSM = VZSM x IZSM. VZSM is the non-repetitive peak reverse voltage at IZSM. Tj = 25 C; f = 1 MHz.
Fig.4
Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse).
Fig.5
Diode capacitance as a function of reverse voltage; typical values.
1997 Dec 01
4
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
handbook, full pagewidth ESD TESTER
RZ CZ
450
RG 223/U 50 coax
10x ATTENUATOR note 1
DIGITIZING OSCILLOSCOPE CH1 50
IEC 1000-4-2 network CZ = 150 pF; RZ = 330
450 input output
RG 223/U 50 coax
10x ATTENUATOR note 1
DIGITIZING OSCILLOSCOPE CH2 50
1/9 BZA109 vertical scale = 100 V/Div horizontal scale = 50 ns/Div
Note 1: attenuator is only used for open socket high voltage measurements
vertical scale = 10 V/Div horizontal scale = 50 ns/Div output GND
input GND GND unclamped +1 kV ESD voltage waveform (IEC1000-4-2 network) clamped +1 kV ESD voltage waveform (IEC1000-4-2 network)
GND
vertical scale = 10 V/Div horizontal scale = 50 ns/Div
GND input
vertical scale = 100 V/Div horizontal scale = 50 ns/Div unclamped -1 kV ESD voltage waveform (IEC1000-4-2 network)
GND output clamped -1 kV ESD voltage waveform (IEC1000-4-2 network)
MBK273
Fig.6 ESD clamping test set-up and waveforms.
1997 Dec 01
5
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
APPLICATION INFORMATION Typical common anode application
BZA109
A 9-fold transient suppressor in an SO20; SOT163-1 package makes it possible to protect nine separate lines using only one package. Two simplified examples are shown in Figs 7 and 8.
handbook, full pagewidth
keyboard, terminal, printer, etc.
I/O
FUNCTIONAL DECODER A B C D E F G H I
BZA109 GND
MBK274
Fig.7 Computer interface protection.
handbook, full pagewidth
VDD VGG address bus
RAM
ROM
I/O
data bus
CPU CLOCK
control bus
4/9 BZA109 GND
MBK275
Fig.8 Microprocessor protection.
1997 Dec 01
6
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
Device placement and printed-circuit board layout
BZA109
Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA109 is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors. 2. Keep parallel signal paths to a minimum. 3. Avoid running protection conductors in parallel with unprotected conductors. 4. Minimize all printed-circuit board loop areas including power and ground loops. 5. Minimize the length of the transient return path to ground. 6. Avoid using shared transient return paths to a common ground point.
1997 Dec 01
7
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
PACKAGE OUTLINE SO20: plastic small outline package; 20 leads; body width 7.5 mm
BZA109
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
ISSUE DATE 95-01-24 97-05-22
1997 Dec 01
8
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values
BZA109
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Dec 01
9
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
NOTES
BZA109
1997 Dec 01
10
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
NOTES
BZA109
1997 Dec 01
11
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA56
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
117027/00/03/pp12
Date of release: 1997 Dec 01
Document order number:
9397 750 03108

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